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TPS3707-30DGN

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Answered (Verified) This post has 1 verified answer | 3 Replies | 2 Followers

Top 500 Contributor
24 Posts
Community Member
gge posted on 2 Sep 2009 2:22 PM

Hello

This is a very specific question regarding the DGN package for the 3707.  Does the PowerPad under the part connect to the GND signal of the part or what signal is the PowerPad connected to?

Answered (Verified) Verified Answer

Top 150 Contributor
46 Posts
Texas Instruments Employee
Verified by gge

Yes.  It is not a requirement to connect the thermal pad to anything on the TPS3707.  The device normally dissipates a couple of milliwatts which doesn't amount to much thermally.

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Top 150 Contributor
46 Posts
Texas Instruments Employee

On the board, the thermal pad can be soldered to a floating plane of copper or to a ground plane.  If you connect the thermal pad to ground, you will still need to connect  the ground pin of the IC to the board ground.  The substrate silicon (ground) of the IC is glued to the thermal pad but this makes a poor electrical connection. 

 

Top 500 Contributor
24 Posts
Community Member

Scott

Thank you very much for the quick response.  So the pad than is just needed for thermal reasons.  If I wanna use this to replace a MAX708 part which is laid out on a board without the thermal pad than the reprocussions are decreased thermal efficiency right?  It seems though the part only draws in the uA range for IDD so I don't see how there could be many thermal issues.

Thanks again,

Gary

 

Top 150 Contributor
46 Posts
Texas Instruments Employee
Verified by gge

Yes.  It is not a requirement to connect the thermal pad to anything on the TPS3707.  The device normally dissipates a couple of milliwatts which doesn't amount to much thermally.

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