TI E2E Community (Beta)
Welcome to the TI E2E (Engineer-to-Engineer) Community! We invite you to freely and openly interact with your peer Engineers, TI Engineers, and other experts in order to ask questions, share knowledge, explore ideas, and help solve problems.
More Search Options

ARM technologies: Resting at the heart of our favorite devices

As consumers, you and I both realize that high-tech devices – from smartphones to heart monitors – continue to revitalize the way we interact with the world, share information, capture memories and experience life. With each technological milestone, engineers and manufacturers alike continue to push the innovation envelope to keep products unique and differentiated.  ARM® technologies spur that innovation, and rest at the heart of so many devices that we rely on each day.

 

This is the focus of the ARM TechCon 3 event, happing this week in Santa Clara. If you are at the show, swing by Ballroom G tomorrow, October 22, at 2:00 PM Pacific to hear about how ARM technologies help designers achieve the scalability, software availability and product differentiation necessary to “wow” our senses and keep us fully connected. The below-listed panelists – Will, Jean, Gene and Tom – will examine how ARM technologies meet market needs today and provide a foundation for future support with high-performance, low-power solutions that drive various markets forward. They’ll answer questions after the session, and would also love to hear about how ARM technology-based solutions help you win. If you’re not at the show, we still want to hear from you. Comment here or send @TXInstruments a Tweet to let us know how ARM solutions help you succeed!

 

ARM TechCon 3 panel:  “Meeting your goals and solving design challenges with ARM technologies”

  • Date/Time: October 22, 2009 @ 2:00 PM Pacific
  • Location: Ballroom G, Santa Clara Convention Center
  • Panelists:
  • Will Tu, embedded segment market manager with ARM
  • Jean Anne Booth, worldwide director, Stellaris® MCU marketing and customer-facing engineering with TI
  • Gene Frantz, TI futurist and principal fellow
  • Tom Starnes, chief analyst with Objective Analysis (moderator)

 

Posted by Missy Haddad, GolinHarris Dallas


Posted Oct 21 2009, 06:03 PM



ALL CONTENT AND MATERIALS ON THIS SITE ARE PROVIDED "AS IS". TI AND ITS RESPECTIVE SUPPLIERS MAKE NO REPRESENTATIONS ABOUT THE SUITABILITY OF THESE MATERIALS FOR ANY PURPOSE AND DISCLAIM ALL WARRANTIES AND CONDITIONS WITH REGARD TO THESE MATERIALS, INCLUDING BUT NOT LIMITED TO, ALL IMPLIED WARRANTIES AND CONDITIONS OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE, TITLE AND NON-INFRINGEMENT OF ANY THIRD PARTY INTELLECTUAL PROPERTY RIGHT. NO LICENSE, EITHER EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, IS GRANTED BY TI. USE OF THE INFORMATION ON THIS SITE MAY REQUIRE A LICENSE FROM A THIRD PARTY, OR A LICENSE FROM TI.

Content on this site may contain or be subject to specific guidelines or limitations on use. All postings and use of the content on this site are subject to the Terms of Use of the site; third parties using this content agree to abide by any limitations or guidelines and to comply with the Terms of Use of this site. TI and its suppliers reserve the right to make corrections, deletions, modifications, enhancements, improvements and other changes to the content and materials, its products, programs and services at any time or to move or discontinue any content, products, programs, or services without notice.